RELIFE 183°C Medium Temperature No-Clean Solder Paste Flux RL-400/401/402 SolderTin Sn63/Pb67 BGA Reballing Soldering tin

₹249.00

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RELIFE No-clean Soldering Paste RL-400 RL-401 RL-402 40g Sn63/Pb67 183°C Solder Paste for iphone mobile phone BGA Reballing Soldering 
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RELIFE Solder Paste Flux-RL-400 RL-401 RL-402 183°C Solder Tin Sn63/Pb67 20-38um, RELIFE Solder Paste, Unique manufacturing of solder past
technology, giving a new definition of tin-base technology
RELIFE No-clean Soldering Paste RL-402 Sn63/Pb67 183°C Solder Paste
183°C Solder paste with high quality
Solder wicking is strong
Less residual
No clean

 

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